"Conductive Grade" Silver Epoxy
Ideal for semiconductor die attach and interconnection between modules and substrates.
The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.
- 企業：DAIZO NICHIMOLY
- 価格：Other
Conductive Epoxy Adhesive(resin) - メーカー・企業と業務用製品 | イプロスものづくり
Conductive Epoxy Adhesiveの製品一覧
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Conductive Epoxy Adhesiveの関連カテゴリ
- Epoxy adhesive
- tile epoxy adhesive
- Flexible Epoxy Adhesive
- Hardening Epoxy Adhesive
- High heat resistant epoxy adhesive
- High strength epoxy adhesive
- Compatible epoxy adhesive
- Low Viscosity Epoxy Adhesive
- UV curing epoxy adhesive
- Material: Epoxy adhesive
- Low halogen epoxy adhesive
- Heat-resistant epoxy adhesive
- Flexible Epoxy Adhesive
- One-component epoxy adhesive
- One-part epoxy adhesive
- Two-component epoxy adhesive
- sealing epoxy adhesive
- Highly heat conductive epoxy adhesive
- Thermally Conductive Epoxy Adhesive
- Fast curing epoxy adhesive
